Solder Resist Market - Forecast(2024 - 2030)

The Solder Resist market size is forecast to reach USD 1,270 million by 2029, after growing at a CAGR of 5.1% during 2024-2029. A subset of the larger electronics business is the solder resist market. Applied to printed circuit boards (PCBs), solder resist—also called solder mask—is a coating that guards the copper traces and keeps solder bridges from forming during the soldering process. In addition, it offers insulation and defense against outside influences. The growing need for electronic devices in a variety of industries, including consumer electronics, automotive, telecommunications, and industrial automation, is the main factor propelling the solder resist market. The need for increasingly sophisticated solder resist materials is partly driven by technological developments that increase the density and complexity of electronic components. Typically, epoxy, polyurethane, or liquid photoimageable (LPI) compositions serve as the basis for solder resist materials.

Environmentally friendly solder resist compositions have been introduced by Henkel, a well-known maker of solder products. Their goods are designed to minimize environmental effect while keeping PCB manufacturing processes operating at peak efficiency. The Swedish firm Mycronic AB, which specializes in manufacturing apparatus for the electronics sector, has created sophisticated inkjet printing systems intended for use with solder masks. Their technologies improve the quality and productivity of PCB manufacture by providing precise solder resist material deposition. Solder resist materials are among the hazardous compounds that are prohibited from being used in electrical and electronic equipment by the EU's Restriction of Hazardous compounds (RoHS) Directive. The market acceptance of environmentally friendly solder resist compositions is influenced by compliance with certain standards.

The report “Solder Resist Market – Forecast (2024-2029)”, by IndustryARC, covers an in-depth analysis of the following segments of the Solder Resist market.

By Type: Top and Bottom Side Masks, Epoxy Liquid Solder Masks, Liquid Photo Imageable Solder Masks, Dry Film Photo Imageable Solder Masks, Photo Imageable Solder Masks, UV Curable Solder Masks, Thermal Curable Solder Masks

By Technology: Screen Printing, Spray Coating, Electrostatic Spray, Dipping

By Application: Consumer Electronics, Automobile Electronics, Communications, Industrial Electronics, Medical Electronics, Aerospace and Defense, Others

By Geography:  North America, South America, Europe, Asia-Pacific, RoW

● Technological Progress Mycronic AB's creation of sophisticated inkjet printing systems for solder mask applications is propelling market growth and a major technological improvement in the sector. These devices provide accurate solder resist material deposition, improving the effectiveness and caliber of PCB manufacturing operations all around the world.

● The industry's dedication to lessening its influence on the environment is demonstrated by Henkel's release of ecologically friendly solder resist compositions. PCB makers worldwide are increasingly using these formulations, which put sustainability first without sacrificing performance, in order to comply with laws like the EU's RoHS Directive.

● Due to its rapid industrialization and rising demand for electronic gadgets, the Asia-Pacific region, especially nations like China and India, offers substantial potential opportunities in the solder resist market. Innovative solder resist materials are being developed locally by companies like Taiyo Ink, based in Taiwan, to meet the specific needs of these markets. The requirement for greater dependability in the electronic devices made in the area is met by Taiyo Ink's UV-curable solder resist formulations, which propels market growth and expansion.

Solder masks that are UV curable have faster curing periods than those that are thermally curable. As a result, PCB manufacturing processes become more efficient and have faster production cycles. Solder masks that are UV curable are frequently thought to be more environmentally friendly than those that are thermally curable. During curing, they usually release fewer volatile organic compounds (VOCs), which is in line with industry environmental efforts and regulatory standards. Excellent adhesive qualities and dependable protection for printed circuit boards (PCBs) against environmental conditions and solder bridging during assembly operations are features of UV curable solder masks. Their extensive use in a variety of electronic applications is partly due to their excellent performance.

A revolutionary UV curable solder mask formulation with improved heat resistance and chemical stability was recently released by Chemtronics, a well-known provider of specialty chemicals and cleaning solutions. The increasing need for solder masks in automotive and industrial electronics applications that can survive high operating temperatures and challenging environmental conditions is being met by this breakthrough. For PCB producers looking to provide dependable and long-lasting products, the formulation is a top option due to its exceptional performance and compatibility with lead-free soldering procedures.

Screen Printing dominated the Solder Resist market in 2023. One well-known and developed technology used in PCB manufacture is screen printing. When compared to other techniques, screen printing is comparatively cheap, which makes it appealing for large-scale manufacturing. A large variety of solder resist substrates and materials can be handled by screen printing, providing production processes flexibility. The adoption hurdle is lowered because screen printing equipment is already present in many PCB production sites. Leading supplier of precision dispensing equipment, Nordson Corporation, has unveiled cutting-edge inkjet printing systems designed specifically for solder resist applications. When compared to conventional screen printing techniques, these technologies provide advantages like increased efficiency, lower material waste, and higher precisi

Consumer Electronics dominated the Solder Resist market in 2023. Due to its extensive use in gadgets like computers, tablets, and smartphones, consumer electronics has taken the lead among the different uses for solder resist. Solder resist materials are in high demand because of the consumer electronics industry's increased demand for PCBs, which are crucial parts of electronic products. In an effort to encourage resource efficiency and waste reduction, the European Union unveiled the Circular Economy Action Plan. The EU has proposed laws to encourage the use of recycled materials, particularly solder resist materials, in the manufacturing of electronics as part of this project. These rules incentivize businesses to implement environmentally conscious methods and lessen the impact of their products on the environment.

Asia Pacific dominated the Solder Resist market in 2023. APAC is a significant hub for electronics production, with nations like China, Japan, South Korea, and Taiwan standing out in particular. Electronic devices and printed circuit boards (PCBs) are produced on a huge scale in the region because to its advanced infrastructure and highly skilled labor force. With businesses extensively spending in research and development (R&D) to develop novel solder resist materials and manufacturing techniques, APAC leads the world in technical developments. This innovation promotes market expansion and competitiveness in the area. Leading producer of solder resist materials, Taiyo Ink, has created cutting-edge UV-curable formulations especially suited to the demands of the APAC markets. These materials satisfy the strict reliability requirements set by the local producers of electronic devices by providing better heat resistance and adhesive qualities. This development underscores the ongoing innovation and market leadership of APAC-based companies in the solder resist industry.

The development of solder resist materials and application techniques is fueled by technological breakthroughs, which enhance PCB manufacturing performance, efficiency, and dependability. A Swedish business called Mycronic AB has just released sophisticated inkjet printing devices designed for the use of solder masks. These devices enable finer details on PCBs and improve manufacturing efficiency by providing precise solder resist material deposition. With this breakthrough, solder resist technology has advanced significantly and manufacturers now have access to more accurate and affordable options.

The demand for PCBs and solder resist materials is driven by the widespread use of electronic devices in numerous industries. The demand for more advanced and dependable electrical components is being driven by the expanding use of technologies like 5G, IoT, and electric cars. The popularity of electric vehicles (EVs) has increased demand for solder resist materials and high-performance printed circuit boards. In response, businesses such as Henkel have created solder resist compositions specifically designed to meet the demanding needs of electric vehicle applications. To ensure the dependability and longevity of electronic components in electric vehicles (EVs), these formulations provide improved mechanical and thermal qualities to survive the demanding working conditions of EVs.

For producers of solder resist, adhering to ever stricter environmental standards, such RoHS requirements, is a major problem. These laws forbid the use of dangerous materials in electronic devices, forcing manufacturers to create environmentally safe formulas without sacrificing functionality. Leading producer of solder resist materials, Henkel, has unveiled a new range of environmentally friendly formulations that are made to satisfy legal criteria without sacrificing performance standards. These formulations guarantee environmental laws are met without compromising quality or dependability because they are devoid of dangerous materials like lead and cadmium.

Solder resist materials and manufacturing techniques need constant innovation in order to keep up with the rapid expansion of electronic devices and PCB technologies. Organizations have difficulties in keeping up with the latest technical developments and satisfying the more intricate demands of contemporary electronic applications. The Swedish firm Mycronic AB, which specializes in manufacturing apparatus for the electronics sector, has created sophisticated inkjet printing systems intended for use with solder masks. These devices enable manufacturers to address the demands of tiny electronic components and high-density PCBs by providing precise solder resist material deposition. The demand for creative manufacturing techniques to meet the increasing complexity of electronic devices is addressed by this real-time development.

Technology launches, acquisitions, and R&D activities are key strategies adopted by players in the Solder Resist market. Major players in the Solder Resist market are Henkel AG & Co. KGaA, Taiyo Ink Mfg. Co., Ltd., Panasonic Corporation, Dow Inc., Hitachi Chemical Co., Ltd., Chang Chun Group, Electrolube (HK Wentworth Ltd.), Shin-Etsu Chemical Co., Ltd., Fuji Chemical Industrial Co., Ltd., and Aisling Industries Ltd. among others.

● In October 2023, Henkel introduced a new line of eco-friendly solder resist formulations designed to meet stringent environmental regulations while maintaining high performance standards. These formulations are free from hazardous substances such as lead and cadmium, aligning with the company's commitment to sustainability.

● In March 2023, Taiyo Ink launched an advanced UV-curable solder resist material with improved heat resistance and adhesion properties. This development caters to the growing demand for high-quality solder resist materials in the electronics manufacturing industry.

● In July 2023, Panasonic announced the development of a new solder resist material with enhanced thermal conductivity for use in high-power electronic devices. This innovation addresses the need for reliable thermal management solutions in advanced electronic applications.