FC BGA - Industry Analysis, Market Size, Share, Trends, Application Analysis, Growth And Forecast 2024-2030

FC BGA Overview:

FC BGA (Flip Chip Ball Grid Array) size is estimated to reach $14.32 billion by 2030, growing at a CAGR of 6.9% during the forecast period 2024-2030. The electronic industry has increased the use of flip chips because of their multiple advantages, including cheaper cost, greater packing density, enhanced circuit reliability, and smaller dimensions. Consequently, the global increase in demand for smart electronics is likely to boost the growth of the global FC BGA. Additionally, by proving to be an appropriate solution for electrical interconnections, the flip chip has transformed the portable electronics and electric car sectors.

Some prominent manufacturers are increasing their investment in these technologies, broadening their coverage. For instance, in March 2021, Samsung Electronics collaborated with Marvell to create a revolutionary system-on-a-chip to improve 5G network performance. The newly released chip is used in Samsung's huge MIMO and is expected to be available to Tier One operators by Q2 2021. Similarly, in November 2020, Mediatek, Inc. agreed to pay roughly USD 85 million for Intel Enpirion's power management chip assets.

Market Snapshot: 

FC BGA - Report Coverage:

The “FC BGA Report - Forecast (2024-2030)” by IndustryARC, covers an in-depth analysis of the following segments in the FC BGA.

COVID-19 / Ukraine Crisis - Impact Analysis:  

• The market for Flip Chip was hit by the COVID-19 pandemic. The pandemic has affected global supply chains, resulting in shortages of some materials and components used in flip chip manufacturing. This has resulted in production delays and higher expenditures. With several industries experiencing a decline as a result of Covid-19, demand for flip chip devices has decreased. As a result, firms in the industry have seen decreasing revenues and earnings.
• The conflict between Russia and Ukraine caused significant global instability and a wide range of issues in the world economy. Russia and Ukraine are both major semiconductor players, with multiple semiconductor production facilities situated in both nations. The war caused supply chain interruptions, particularly in transportation, logistics, and material procurement.

Key Takeaways:

Dominance of Asia-Pacific

Geographically, Asia-Pacific (FC BGA) held the largest share with 72% of the overall market in 2023 and it is poised to dominate the market over the period 2024-2030. This is owing to the Asia Pacific FC BGA being highly competitive, with key players including Amkor Technology Inc., ASE Group, Powertech Technology Inc., STATS ChipPAC Ltd., and United Test and Assembly Center Ltd. These companies are focusing on developing new products and technologies to maintain their market position and gain a competitive edge.

Laminates Segment holds the largest market share

Based on Substrate, the Laminates Segment held the largest FC BGA share in 2023 and it is estimated to grow with a CAGR of 7.8% during the forecast period 2024-2030. This is owing to the growing demand for advanced electronic devices with higher performance and smaller form factors. This includes smartphones, tablets, wearables, and other portable devices that require high-speed data transfer, low power consumption, and robust reliability.

High growth in Automotive Sector

Based on End User, the Automotive segment is estimated to grow with the fastest CAGR of 9.0% during the forecast period 2024-2030. This is owing to the increasing adoption of electric and autonomous vehicles as these vehicles require high-performance computing power and reliability. The rise in demand for flip chip technology in the automotive industry is expected to continue as the industry continues to innovate and adopt new technologies. In 2020, Tesla, Inc. announced a $1.4 billion investment in its Shanghai factory to increase the production of its electric vehicles. In the same year, General Motors (GM) revealed that it would invest $2.2 billion in its Detroit-Hamtramck assembly plant to produce a range of electric trucks and SUVs.

Miniaturization of electronic devices is projected to fuel market growth

With the increasing demand for smaller, lighter, and more powerful electronic devices, flip chip technology has become the preferred choice for chip packaging due to its compact size, high density, and improved electrical and thermal performance.

Growth in IoT devices globally is anticipated to drive market growth

The Internet of Things (IoT) has seen rapid growth in recent years, with an increasing number of connected devices entering the market. The compact size, high-density, and improved performance of flip chip technology make it an ideal solution for IoT devices that require small form factors and high reliability.

Complex design and manufacturing processes hamper the market growth

Flip chip packaging involves a complex process that requires precise alignment, soldering, and interconnection of a large number of microbumps. This complex process presents significant challenges to manufacturers, including yield losses and high capital expenditure requirements is one of the factors hampering the growth of the FC BGA.

FC BGA: Market Share (%) by Region, 2023

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Key Market Players: 

Product/Service launches, approvals, patents and events, acquisitions, partnerships and collaborations are key strategies adopted by players in the FC BGA. The top 10 companies in the FC BGA are:

1. Texas Instruments 
2. STMicroelectronics 
3. Intel Corporation 
4. Samsung Group 
5. Amkor Technology 
6. TDK Electronics Europe 
7. IBM Corporation
8. Taiwan Semiconductor Manufacturing Company 
9. 3M Company 
10. Kyocera International 

Scope of Report: 

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